From
October 8th, 2024
To
October 11th, 2024
Bondexpo 2024
Event Information
Bondexpo is an international trade fair for bonding technology, hosted by P. E. Schall GmbH & Co. KG. This event has quickly become the world's number one user meeting place for joining and bonding processes. Bondexpo will be held at Messepiazza 1, 70629 Stuttgart, Stuttgart, Germany, and will provide attendees with detailed and system solutions for present and future challenges in the field of joining and bonding the broadest range of materials.
This event is the perfect opportunity to discover the latest advancements in bonding technology, from gluing to moulding, sealing and foaming. Exhibitors will be able to showcase their products and services to a global audience, while attendees can explore the latest innovations and find the perfect solutions for their needs. Bondexpo is the perfect place to network and build relationships with industry professionals.
Bondexpo is the ideal event for those looking to stay up-to-date with the latest developments in bonding technology. With its focus on the process chain of joining and bonding, this event provides the perfect platform for exhibitors to showcase their products and services to a global audience. Attendees will be able to explore the latest innovations and find the perfect solutions for their needs.
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P.E. Schall GmbH & Co. KG