The International Conference on Electronic Packaging Technology (ICEPT) is a prestigious event in the field of electronic packaging. Recognized as one of the top four academic conferences in this domain, ICEPT offers a platform for professionals and experts to gather and exchange knowledge. Hosted by the Institute of Microelectronics of Chinese Academy of Sciences (IMECAS), IEEE Electronics Packaging Society (IEEE-EPS), and the Electronic Manufacturing & Packaging Technology Society of Chinese Institute of Electronics (CIE-EMPT), this conference is organized by Beijing branch of IEEE-EPS and Bei Jing Heng Ren Zhi Xin Consulting Company.

With a rich history dating back to 1994, ICEPT has been held at various esteemed universities in China, including Tsinghua University, Fudan University, and Shanghai Jiaotong University. This event covers a wide range of topics such as Packaging Design, Manufacturing Technologies, R&D, and Photonics, MEMS, System Integrated Packaging, attracting participants from domestic and international universities, research institutions, and electronic packaging manufacturers. With over 20 sessions and the support of relevant government units, ICEPT has established itself as a must-attend event for more than 500 renowned experts, scholars, and business people from approximately 20 countries and regions.

Join us at ICEPT to connect with industry leaders, gain valuable insights, and stay updated on the latest advancements in electronic packaging technology. Whether you are an academic, researcher, or industry professional, this conference provides a unique opportunity to network and collaborate with like-minded individuals in the field. Don't miss out on this premier event in the heart of China's electronic packaging industry.