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July 10th, 2022

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IEEE FLEPS 2022

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The IEEE FLEPS 2022 is recognized as a pivotal platform where research scientists, engineers, and practitioners converge to share insights and advancements in the field of Flexible and Printable Sensors and Systems. This event is designed to showcase the latest research findings, innovative ideas, and practical applications that are shaping the future of this dynamic industry. Attendees are provided with an opportunity to explore cutting-edge developments and engage with thought leaders who are at the forefront of technological innovation in flexible and printed electronics.

A particular emphasis is placed on the burgeoning interest in material printing on flexible and disposable substrates, which is driving the development of cost-effective, large-area electronics and sensing systems. The integration of novel methods such as additive manufacturing and advanced printing techniques is being highlighted, showcasing how these approaches are revolutionizing the creation of deployable systems like displays, sensors, and RFID tags. The adaptation of technologies initially developed for silicon-based electronics to meet the unique demands of flexible and printed sensors is also a key focus, underscoring the transformative potential of these innovations.

The IEEE FLEPS 2022 serves as a crucial forum for discussing the exponential growth observed in flexible, printed, and disposable sensor technology. The event facilitates the exchange of knowledge on the development of novel printable and solution-processable nanomaterials, as well as the pioneering printing techniques that are driving a new wave of sensor technologies and applications. Participants are afforded the chance to delve into the latest trends and future roadmaps, ensuring they remain at the cutting edge of this rapidly evolving field. The event is a must-attend for those seeking to understand and influence the trajectory of flexible and printable sensor systems.

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Contact Information

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https://2022.ieee-fleps.org/

No e-mail provided

Organizer(s)

IEEE Sensors Council

Available Booths

Location

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TU Wien, Vienna, Austria, Austria

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Floor Plan(s)

Supporting documents (if any)

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TBD, TBD, TBD, TBD
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