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October 8th, 2012

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Microsys 2012

Event Information

Discover the latest advancements in industrial bonding technology at Microsys 2012, a concurrent expo with BONDexpo 2012. This trade fair is the perfect platform for exhibitors to showcase their cutting-edge products and services in the field of industrial bonding. With a focus on innovation and efficiency, Microsys 2012 offers a unique opportunity for industry professionals to connect with potential partners and stay ahead of the competition.

At Microsys 2012, exhibitors will have the chance to demonstrate their expertise in industrial bonding technology to a targeted audience of industry leaders and decision-makers. This event provides a comprehensive overview of the latest trends and developments in the field, allowing exhibitors to gain valuable insights and forge strategic partnerships. With a wide range of exhibitors from across the globe, Microsys 2012 offers a diverse and dynamic environment for networking and collaboration.

Located in Stuttgart, Germany, Microsys 2012 is easily accessible and centrally located, making it the ideal destination for exhibitors looking to expand their reach in the European market. With its state-of-the-art facilities and professional atmosphere, the event provides a conducive environment for exhibitors to showcase their products and services. Don't miss out on this opportunity to connect with industry leaders and explore new business opportunities at Microsys 2012.

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Contact Information

No phone number provided.

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Organizer(s)

P.E. Schall GmbH & Co. KG

Available Booths

Location

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Messepiazza 1, 70629 Stuttgart, Stuttgart, Germany, Germany

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Floor Plan(s)

Supporting documents (if any)

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