Contact Information
From
October 7th, 2013
To
October 10th, 2013
Microsys 2013
Event Information
Discover the latest advancements in industrial bonding technology at Microsys 2013, the premier event in the field. This highly anticipated trade fair brings together experts, innovators, and industry leaders to showcase cutting-edge solutions and foster collaboration. With a concurrent expo, BONDexpo 2013, attendees can explore a wide range of products and services related to industrial bonding technology.
At Microsys 2013, exhibitors have the unique opportunity to showcase their products and services to a targeted audience of professionals in the industry. This event attracts a diverse range of attendees, including engineers, researchers, and decision-makers, providing exhibitors with valuable networking opportunities and potential business partnerships. With a focus on the latest trends and developments in industrial bonding technology, exhibitors can position themselves as industry leaders and gain exposure to a highly engaged audience.
Located in Stuttgart, Germany, the heart of the industrial sector, Microsys 2013 offers exhibitors a prime location to connect with key players in the industry. The event venue, Messepiazza 1, provides a state-of-the-art exhibition space, ensuring that exhibitors can showcase their products and services in the best possible light. Don't miss out on this opportunity to be part of the leading event in industrial bonding technology and make a lasting impression on industry professionals.
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Organizer(s)
P.E. Schall GmbH & Co. KG
Available Booths
Location
Messepiazza 1, 70629 Stuttgart, Stuttgart, Germany, Germany
Don’t forget to Book your Hotel’s Rooms:
Floor Plan(s)
Supporting documents (if any)
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