The Electronics System-Integration Technology Conference (ESTC 2024) is recognized as the leading international event dedicated to the field of electronics packaging and system integration. This prestigious conference is organized biennially, providing a platform where the latest advancements and innovations in electronics are showcased. Supported by IEEE-EPS in collaboration with IMAPS Europe, the event brings together industry leaders, researchers, and professionals from around the globe to exchange knowledge and explore cutting-edge technologies.

A comprehensive program has been curated, featuring keynote presentations, technical sessions, and interactive workshops. Attendees are offered the opportunity to gain insights into emerging trends and challenges within the electronics industry. The event serves as a hub where pioneering ideas are shared, fostering collaboration and inspiring future developments in electronics system integration. Exhibitors are provided with a unique chance to present their solutions and engage with a diverse audience of experts and decision-makers.

Networking opportunities abound at ESTC 2024, with numerous sessions designed to facilitate connections among participants. The conference environment is conducive to building partnerships and exploring business opportunities. By participating, exhibitors can enhance their visibility and establish their presence in the competitive landscape of electronics packaging. The event is a must-attend for those seeking to stay at the forefront of technological advancements and to contribute to the evolution of the electronics industry.