The Electronics in Harsh Environments Conference, hosted by SMTA Europe in Amsterdam, Netherlands, provides an opportunity to explore the challenges of building reliable electronics used in power electronics and harsh environments. Thermal, power and signal integrity requirements can present a challenge when creating devices that operate within harsh environments. Component integration, paired with a growing complexity of the package architectures, larger form factors and higher interconnection densities, increase the risk of in-field failures.

The conference will explore the potential risks of over powering or over heating of a device, which can have serious consequences such as internal package failure, down-stream device errors and second level interconnect solder joint failures. Additionally, soldering residues will be discussed, and how they can result in both intermittent and complete device failure if not understood.

The Electronics in Harsh Environments Conference will be held at the Park Plaza Amsterdam Airport, offering attendees an opportunity to learn from experts in the field and network with peers in a professional setting. Join us in Amsterdam to explore the latest developments in electronics used in harsh environments.