Contact Information
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ESTC 2026
Event Information
ESTC is the premier venue for academics and industry to present and discuss the latest developments in assembly and interconnection technology and new applications. Organized by IEEE-EPS (former CPMT) since, ESTC completes the triumvirate together with ECTC in the United States and EPTC in Singapore and thus supports the global community of electronics packaging engineers and scientists.
This event provides a platform for exhibitors to showcase their products and services to the global electronics community and to network with potential customers. It is an opportunity to learn about the latest advancements in the field and to gain insights into the future of electronics.
The location of ESTC is yet to be determined, but it promises to be an event that will be remembered for years to come. Don't miss out on the chance to be part of this unique experience.
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Organizer(s)
IEEE Electronics Packaging Society
Available Booths
Location
TBD,
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TBD, TBD
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Floor Plan(s)
Supporting documents (if any)
Other editions
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