The SEMI 3D & Systems Summit is an event designed to bring together the world's leading experts in 3D packaging, Heterogeneous Integration, and System-In-Package (SiP) manufacturing. Held in the beautiful city of Dresden, Germany, the summit will provide an ideal platform for exhibitors, speakers, and attendees to explore the latest developments in the field and engage in meaningful conversations.

The summit will address the most relevant and advanced topics related to the 3D packaging roadmap, Heterogeneous Integration and System-In-Package (SiP) manufacturing. With a focus on high reliability and high performance of disruptive applications like Mobile and IoT, the event will provide an opportunity to explore the potential of these technologies and how they can be applied to create innovative solutions.

The SEMI 3D & Systems Summit will feature invited distinguished global industry speakers, an exhibition area, B2B matchmaking, and unique networking and business opportunities. The event will be held at the Hilton Dresden Hotel, providing a luxurious and comfortable setting for all attendees.