Contact Information
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https://www.semi.org/eu/connect/events/3d-and-systems-summit
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From
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SEMI 3D & Systems Summit 2025
Event Information
The SEMI 3D & Systems Summit is an event designed to bring together the world's leading experts in 3D packaging, Heterogeneous Integration, and System-In-Package (SiP) manufacturing. Held in the beautiful city of Dresden, Germany, the summit will provide an ideal platform for exhibitors, speakers, and attendees to explore the latest developments in the field and engage in meaningful conversations.
The summit will address the most relevant and advanced topics related to the 3D packaging roadmap, Heterogeneous Integration and System-In-Package (SiP) manufacturing. With a focus on high reliability and high performance of disruptive applications like Mobile and IoT, the event will provide an opportunity to explore the potential of these technologies and how they can be applied to create innovative solutions.
The SEMI 3D & Systems Summit will feature invited distinguished global industry speakers, an exhibition area, B2B matchmaking, and unique networking and business opportunities. The event will be held at the Hilton Dresden Hotel, providing a luxurious and comfortable setting for all attendees.
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Organizer(s)
SEMI - Semiconductor Equipment and Materials International
Available Booths
Location
Hilton Dresden Hotel,
Dresden,
Germany, Germany
Don’t forget to Book your Hotel’s Rooms:
Floor Plan(s)
Supporting documents (if any)
Other editions
SEMI 3D & Systems Summit 2024
The SEMI 3D & Systems Summit is a premier event for the 3D packaging roadmap, Heterogeneous Integration, and System-In-Package (SiP) manufacturing industries. Held at the Dresden Hilton Hotel in Dresden, Germany, the summit brings together experts from around the world to discuss the most advanced...
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SEMI 3D & Systems Summit 2020
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The SEMI 3D & Systems Summit 2020 has been recognized as a pivotal event for those invested in the future of 3D packaging and system integration. The summit's agenda has been meticulously crafted to address the most advanced topics in the industry, including the 3D packaging ro...
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