Contact Information
From
December 3rd, 2024
To
December 6th, 2024
IEEE EPTC 2024
Event Information
The 25th IEEE Electronics Packaging Technology Conference (EPTC2023) is an international event organized by the IEEE RS/EPS/EDS Singapore Chapters and co-sponsored by the IEEE Electronics Packaging Society (EPS). Held in Singapore, this conference offers an exciting opportunity for the international packaging community to come together and explore a wide range of topics, from modules and components to materials, equipment technology, assembly, reliability, interconnect design, device and systems packaging, heterogeneous integration, wafer-level packaging, flexible electronics, LED, IoT, 5G, emerging technologies, 2.5D/3D integration technology, smart manufacturing, automation, and AI.
The EPTC2023 technical program committee is dedicated to providing an engaging and comprehensive technical program for attendees. The program will include keynotes, technical sessions, invited talks, panels, workshops, and networking activities. The exhibition will also provide a platform for leading companies to showcase their latest technologies and products.
This year marks the 25th Anniversary of EPTC2023. We anticipate an even larger turnout than the 430 attendees from last year. Join us in Singapore for a special 4-day program and be part of this milestone event.
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Organizer(s)
IEEE Electronics Packaging Society
Available Booths
Location
Singapore,
Singapore,
Singapore, Singapore
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