Contact Information
From
September 25th, 2024
To
September 27th, 2024
3DIC 2024
Event Information
Welcome to the IEEE International 3D Systems Integration Conference (3DIC)!
Since its inception in 2009, 3DIC has witnessed a remarkable transformation in the world of 3D integrated circuits. From being an academic curiosity, it has now become a robust commercial reality. This year's conference aims to delve into the latest advancements and breakthroughs in the field of 3DICs.
With a focus on research and science, 3DIC 2024 will explore a wide range of topics related to 3D/Chiplet technology. From manufacturing processes and materials to equipment and circuit designs, this event will bring together experts from around the world to discuss the most recent developments in the industry.
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Organizer(s)
IEEE Electronics Packaging Society
Available Booths
Location
Hotel Metropolitan Sendai,
Sendai,
Japan, Japan
Don’t forget to Book your Hotel’s Rooms:
Floor Plan(s)
Supporting documents (if any)
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