The premier international conference, InterPACK 2023, has been recognized as a pivotal platform for the dissemination of cutting-edge knowledge in the realms of research, development, manufacturing, and applications of electronics packaging and heterogeneous integration. As the flagship conference of the ASME Electronic and Photonic Packaging Division (EPPD), it has been meticulously designed to foster the exchange of innovative ideas and to propel advancements in the field. A diverse array of topics, including Heterogeneous Integration, Servers of the Future, Edge and Cloud Computing, and the Internet of Things, has been covered, ensuring that participants remain at the forefront of technological progress.

The conference has been strategically structured to provide a systems-focused approach, addressing critical areas such as Additive Printed Electronics, Flexible and Wearable Electronics, Photonics and Optics, and Power Electronics. Energy Conversion and Storage, as well as Autonomous, Hybrid, and Electric Vehicles, have been explored through a comprehensive agenda that includes paper presentations, exhibits, and interactive sessions. The international scope of InterPACK 2023 has facilitated invaluable global interactions among industry leaders, academia, research institutions, funding agencies, start-ups, and entrepreneurs, creating a dynamic environment for collaboration and innovation.

Attendees have been offered a rich program featuring panel discussions, workshops, tutorials, and keynote speeches delivered by prominent speakers. Technology talks and a joint industry, national laboratory, and academia poster session have further enriched the experience, providing insights into the latest advancements and future directions in the field. By participating in InterPACK 2023, exhibitors have been afforded the opportunity to showcase their innovations, engage with a diverse audience, and establish connections that drive growth and success in the ever-evolving landscape of electronics packaging and heterogeneous integration.