The International Wafer Level Packaging Conference is an event of great significance for the semiconductor industry. Bringing together the most respected authorities in the field, the conference will address all aspects of wafer-level, 3D device packaging, advanced manufacturing and test technologies. With a rich history of attendees from over 16 countries, the conference will take place in the heart of Silicon Valley, offering a unique opportunity to immerse oneself in the latest technology and business trends.

The International Wafer Level Packaging Conference provides an ideal platform for exhibitors to showcase their products and services. With a wide range of visitors from the semiconductor industry, the event offers an unparalleled opportunity to network and establish relationships with potential customers. Exhibitors will benefit from being at the forefront of the latest technology, gaining valuable insights into the industry.

The International Wafer Level Packaging Conference will take place in Fremont, California, on 46100 Landing Pkwy. It is the perfect event for exhibitors to reach out to their target audience and gain invaluable knowledge and experience. Don't miss out on this unique opportunity to be part of the semiconductor industry's most respected event.