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November 1st, 2026

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ADHESION & BONDING EXPO - TOKYO Nov. 2026

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Event Information

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The Adhesion & Bonding Expo is recognized as the premier international trade fair dedicated to adhesive and joining technologies. A comprehensive array of joining equipment and bonding technologies is showcased, ranging from advanced materials to cutting-edge welding techniques. This event serves as a pivotal platform where the latest innovations in friction stirring, ultrasonic, and diffusion bonding are highlighted, offering unparalleled opportunities for industry professionals to explore new horizons in adhesion solutions.

Attendees at the Adhesion & Bonding Expo are presented with a unique opportunity to witness the forefront of technological advancements in the field of industrial adhesion. The expo is meticulously curated to include a diverse spectrum of exhibitors, each demonstrating their expertise in various bonding technologies. From pioneering materials to state-of-the-art equipment, the event is designed to cater to the needs of professionals seeking to enhance their knowledge and discover innovative solutions that can be applied across multiple industries.

A gathering of this magnitude ensures that the latest trends and developments in adhesive technologies are brought to the forefront, providing exhibitors with a platform to connect with potential partners and clients. The Adhesion & Bonding Expo serves as a nexus for industry leaders, innovators, and decision-makers, fostering an environment where the exchange of ideas and collaboration is encouraged. By participating, exhibitors are afforded the chance to solidify their presence in the market and gain valuable insights into the future of adhesion and bonding technologies.

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Contact Information
Organizer(s)

RX Japan

Available Booths

Location

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Nakase 2-1, Mihama-ku, Chiba City 261-0023, Japan, Japan

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