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May 10th, 2023

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May 12th, 2023

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3DIC 2023

Event Information

Discover the latest advancements and breakthroughs in the world of 3D integrated circuits at the highly anticipated 3DIC 2023 conference. This prestigious event has been at the forefront of the industry since its inception in 2010, witnessing the remarkable transformation of 3D ICs from an academic curiosity to a thriving commercial reality.

With the continuous improvement and evolution of underlying technologies, 3DICs have become more powerful and versatile than ever before. This year's conference will delve into the cutting-edge research and science behind these innovative circuits, exploring a wide range of topics including chiplets, photonic interconnect, micro-die handling, and exotic substrates.

Designed to cater to the needs of industry professionals, the 3DIC 2023 conference will cover a comprehensive range of subjects, from manufacturing processes and materials to circuit designs, design methodology, and applications. Join us at this premier event to gain valuable insights, connect with industry experts, and stay at the forefront of the rapidly evolving world of 3D integrated circuits.

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Contact Information

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https://3dic-conf.org/

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Organizer(s)

IEEE Electronics Packaging Society

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Location

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Tyndall National Institute, Cork, Ireland, Ireland

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