InterPACK is the premier international conference to exchange state-of-the-art knowledge in research, development, manufacturing, and applications of electronics packaging and heterogeneous integration. Hosted by the ASME Electronic and Photonic Packaging Division (EPPD), InterPACK is a systems-focused conference that covers topics such as Heterogeneous Integration, Servers of the Future, Edge and Cloud Computing, Internet of Things, Additive Printed Electronics, Flexible and Wearable Electronics, Photonics and Optics, Power Electronics, Energy Conversion and Storage, and Autonomous, Hybrid and Electric Vehicles.

The conference provides a platform for global interactions between industry, academia, research institutions, funding agencies, start-ups and entrepreneurs. In addition to paper presentations and exhibits, InterPACK will feature panel discussions, workshops, tutorials, keynote and technology talks by prominent speakers, and a joint industry, national laboratory, and academia poster session.

InterPACK will take place at the Doubletree by Hilton San Diego Mission Valley in San Diego, California, United States. This is an ideal opportunity for exhibitors to showcase their products and services to a global audience and establish relationships with industry leaders.